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 Advanced Telecom Computing Architecture
Schroff offers systems designers the most comprehensive AdvancedTCA, AdvancedMC and MicroTCA packaging technology in the industry.
- AdvancedTCA Front Panels and Accessories
- Hot Swap Handles
- Filler Panels and Air Baffles
- AdvancedMC Products 6U and 8U MicroTCA Development Systems
- 2, 5/6, 14, and 16 slot AdvancedTCA Systems
- Shelf Management Technology
- Customized Solutions
Schroffs packaging technology offers these benefits to designers:
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Performance
- 10GB/sec and higher support for a wide range of fabric protocols including PCI Express, Gigabit Ethernet, Infiniband, and Rapid I/O
- 200 watts per slot
- NEBS High Availability
Flexibility
- AdvancedMC mezzanines to upgrade proprietary designs
- Small, embedded MicroTCA solutions
- 16-slot fully integrated AdvancedTCA configurations
Price
- The broadest range of price/performance options of any open architecture systems available
Time-to-Market
- Open architecture solutions significantly reduces time-to-market for boars, software and systems
- OEMs can focus on applications requirements
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